通富微电测试技术
Production Overview
TFME offers various WBBGA and WBLGA package based on customer different requirement.
Features
- 1.1x0.7 mm to 21x21 mm Package
- 0.2mm to 1.0mm C Mold Chase
- 01005 Components SMT
- 0.3x0.3 mm Small Die
- 1-6 Layer Substrate
Process Capability & Design Rule
Reliability Test Standards
Shipment Packing
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