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元件各类封装图示说明
集成电路封装 林夕依然 www.ednchina.com/blog/xiantaozeng/
芯片封装形式的含义

TQFP hin Quad Flat Packs
PPGA Plastic Pin Grid Arrays
Mini-BGA Mini Ball Grid Array
BGA Ball Grid Array
CerDIP Ceramic Dual-In-Line Packages
CQFP Ceramic Flatpacks
CerSOJ Ceramic Small Outline J-Bend
CPGA Ceramic Pin Grid Arrays
WLCC Ceramic Windowed J-Leaded Chip Carriers
PLCC Plastic Leaded Chip Carriers
CerPACK Cerpacks
LCC Ceramic Leadless Chip Carriers
PQFP Plastic Quad Flatpacks
SSOP Shrunk Small Outline Packages
PDIP Plastic Dual-In-Line Packages
QSOP Quarter Size Outline Packages
W-LCC Ceramic Windowed Leadless Chip Carriers
WPGA Ceramic Windowed Pin Grid Arra

关键词： 芯片封装   TSOP   DIP   SOJ   CSP