PCB Design Guidelines for EMI ...
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上传日期：2013-09-22
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CV02-04-PCB Design Guidelines for EMI & ESD SuppressionCITRUSCOM
CV02-04
ESD+EMI Filter Application Note
PCB Design Guidelines for EMI & ESD Suppression
PCB Placement
EMI & ESD Placement Considerations Good placement in PCB design is very important for suppression of EMI & ESD hazards. In general, ESD protection devices should be placed near the I/O connectors and the protected lines. The length of PCB metal traces connecting ESD devices, ICs and I/O connectors is a key factor for the ESD protection of protected IC on PCB. When a surge current of ESD strike comes, the path impedance determines how much current the path would shunt in case that the ESD protection devices and on-chip protection circuits have the same trigger voltage. A shorter trace length equates to smaller impedance, which ensures most the surge energy should be dissipated b
CV02-04
ESD+EMI Filter Application Note
PCB Design Guidelines for EMI & ESD Suppression
PCB Placement
EMI & ESD Placement Considerations Good placement in PCB design is very important for suppression of EMI & ESD hazards. In general, ESD protection devices should be placed near the I/O connectors and the protected lines. The length of PCB metal traces connecting ESD devices, ICs and I/O connectors is a key factor for the ESD protection of protected IC on PCB. When a surge current of ESD strike comes, the path impedance determines how much current the path would shunt in case that the ESD protection devices and on-chip protection circuits have the same trigger voltage. A shorter trace length equates to smaller impedance, which ensures most the surge energy should be dissipated b
关键词： CV02-04-PCB Design Guidelines Suppression
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